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  rev.2.00, oct 06, 2005 page 1 of 7 hd74hc75 quad. bistable latches rej03d0550-0200 (previous ade-205-422) rev.2.00 oct 06, 2005 description this latch is ideally suited for use as temporary storage for binary information processing, input/output, and indicator units. information present at the data (d) input is transferred to the q output when the latch enable (le) is high. the q output will follow the data input as long as the enable remains high. when the enable goes low, the information that was present at the data input at the time the transition occurred is retained at the q output unit the enable is permitted to go high again. features ? high speed operation: t pd (d to q) = 12.5 ns typ (c l = 50 pf) ? high output current: fanout of 10 lsttl loads ? wide operating voltage: v cc = 2 to 6 v ? low input current: 1 a max ? low quiescent supply current: i cc (static) = 2 a max (ta = 25 c) ? ordering information part name package type package code (previous code) package abbreviation taping abbreviation (quantity) hd74hc75p dilp-16 pin prdp0016ae-b (dp-16fv) p ? hd74hc75fpel sop-16 pin (jeita) prsp0016dh-b (fp-16dav) fp el (2,000 pcs/reel) HD74HC75RPEL sop-16 pin (jedec) prsp0016dg-a (fp-16dnv) rp el (2,500 pcs/reel) note: please consult the sales office for the above package availability. function table inputs outputs data latch enable q q l h l h h h h l x l q 0 q 0 h : high level l : low level x : irrelevant q 0 , q 0 : output level before the indicated steady state input conditions were established.
hd74hc75 rev.2.00, oct 06, 2005 page 2 of 7 pin arrangement 1 2 3 4 5 6 7 8 q 0a d 0a d 1a le b v cc d 0b d 1b q 1b q 0a q 1a q 1a le a gnd q 0b q 0b q 1b 16 15 14 13 12 11 10 9 (top view) logic diagram (1/4) data q q latch enable absolute maximum ratings item symbol ratings unit supply voltage range v cc ?0.5 to 7.0 v input / output voltage vin, vout ?0.5 to v cc +0.5 v input / output diode current i ik , i ok 20 ma output current i o 25 ma v cc , gnd current i cc or i gnd 50 ma power dissipation p t 500 mw storage temperature tstg ?65 to +150 c note: the absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time.
hd74hc75 rev.2.00, oct 06, 2005 page 3 of 7 recommended operating conditions item symbol ratings unit conditions supply voltage v cc 2 to 6 v input / output voltage v in , v out 0 to v cc v operating temperature ta ?40 to 85 c 0 to 1000 v cc = 2.0 v 0 to 500 v cc = 4.5 v input rise / fall time *1 t r , t f 0 to 400 ns v cc = 6.0 v note: 1. this item guarantees maximum limit when one input switches. waveform: refer to test circuit of switching characteristics. electrical characteristics ta = 25 c ta = ?40 to+85 c item symbol v cc (v) min typ max min max unit test conditions 2.0 1.5 ? ? 1.5 ? 4.5 3.15 ? ? 3.15 ? v ih 6.0 4.2 ? ? 4.2 ? v 2.0 ? ? 0.5 ? 0.5 4.5 ? ? 1.35 ? 1.35 input voltage v il 6.0 ? ? 1.8 ? 1.8 v 2.0 1.9 2.0 ? 1.9 ? 4.5 4.4 4.5 ? 4.4 ? 6.0 5.9 6.0 ? 5.9 ? i oh = ?20 a 4.5 4.18 ? ? 4.13 ? i oh = ?4 ma v oh 6.0 5.68 ? ? 5.63 ? v vin = v ih or v il i oh = ?5.2 ma 2.0 ? 0.0 0.1 ? 0.1 4.5 ? 0.0 0.1 ? 0.1 6.0 ? 0.0 0.1 ? 0.1 i ol = 20 a 4.5 ? ? 0.26 ? 0.33 i ol = 4 ma output voltage v ol 6.0 ? ? 0.26 ? 0.33 v vin = v ih or v il i ol = 5.2 ma input current iin 6.0 ? ? 0.1 ? 1.0 a vin = v cc or gnd quiescent supply current i cc 6.0 ? ? 2.0 ? 20 a vin = v cc or gnd, iout = 0 a switching characteristics (c l = 50 pf, input t r = t f = 6 ns) ta = 25 c ta = ?40 to +85 c item symbol v cc (v) min typ max min max unit test conditions 2.0 ? ? 125 ? 155 4.5 ? 12 25 ? 31 6.0 ? ? 21 ? 26 ns data to q 2.0 ? ? 110 ? 140 4.5 ? 13 22 ? 28 6.0 ? ? 19 ? 24 ns data to q 2.0 ? ? 145 ? 180 4.5 ? 12 29 ? 36 6.0 ? ? 25 ? 31 ns latch enable to q 2.0 ? ? 125 ? 155 4.5 ? 13 25 ? 31 propagation delay time t plh , t phl 6.0 ? ? 21 ? 26 ns latch enable to q
hd74hc75 rev.2.00, oct 06, 2005 page 4 of 7 switching characteristics (c l = 50 pf, input t r = t f = 6 ns) ta = 25c ta = ?40 to +85c item symbol v cc (v) min typ max min max unit test conditions 2.0 100 ? ? 125 ? 4.5 20 4 ? 25 ? setup time t su 6.0 17 ? ? 21 ? ns data to latch enable 2.0 5 ? ? 5 ? 4.5 5 0 ? 5 ? hold time t h 6.0 5 ? ? 5 ? ns latch enable to data 2.0 80 ? ? 100 ? 4.5 16 5 ? 20 ? pulse width t w 6.0 14 ? ? 17 ? ns latch enable 2.0 ? ? 75 ? 95 4.5 ? 5 15 ? 19 output rise/fall time t tlh , t thl 6.0 ? ? 13 ? 16 ns input capacitance cin ? ? 5 10 ? 10 pf test circuit v cc latch enable v cc z out = 50 ? input data z out = 50 ? input c l = 50 pf output c l = 50 pf output q q note: c includes the probe and jig capacitance. l pulse generator pulse generator see function table
hd74hc75 rev.2.00, oct 06, 2005 page 5 of 7 waveforms 0 v v cc v oh latch enable q 50 % 10 % 90 % t r 50 % 50 % 10 % 90 % t tlh 10 % t thl 50 % 50 % t plh t phl v ol 0 v v cc 50 % 10 % 90 % t r 10 % t f 50 % 50 % d 90 % t h t su t h t su 90 % v oh q 10 % 90 % t tlh 10 % t thl 50 % 50 % t phl t plh v ol 90 % 10 % t f 90 % 50 % t w t w t w t w t phl t plh t phl t plh 1. input waveform: prr 1 mhz, zo = 50 ? , t r 6 ns, t f 6 ns note: ? waveform ? 1
hd74hc75 rev.2.00, oct 06, 2005 page 6 of 7 package dimensions 7.62 dp-16fv renesas code jeita package code previous code max nom min dimension in millimeters symbol reference 19.2 6.3 5.06 mass[typ.] 1.05g a z b d e a b c e l 1 1 p 3 e 0.51 0.56 1.30 0.19 0.25 0.31 2.29 2.54 2.79 0 15 prdp0016ae-b p-dip16-6.3x19.2-2.54 20.32 7.4 0.40 0.48 1.12 2.54 1 p 1 3 1 8 16 9 e b a l a z e c e d b 0.89 ( ni/pd/au plating ) 0.635 0.15 1.27 5.80 6.20 0.40 0.34 p a 1 10.30 fp-16dnv renesas code jeita package code previous code max nom min dimension in millimeters symbol reference 1.75 1.27 0.60 0.40 3.95 0.25 0.14 0.10 0.46 0.25 0.20 0.15 6.10 8 0 0.25 1.08 9.90 0.15g mass[typ.] 1 e 1 1 2 l z h y x c b a e d b c e e l a p-sop16-3.95x9.9-1.27 prsp0016dg-a index mark e 1 y xm p * 3 * 2 * 1 f 8 9 16 e h d a zb terminal cross section ( ni/pd/au plating ) p b c detail f 1 1 l l a note) 1. dimensions" * 1 (nom)"and" * 2" do not include mold flash. 2. dimension" * 3"does not include trim offset.
hd74hc75 rev.2.00, oct 06, 2005 page 7 of 7 0.80 0.15 1.27 7.50 8.00 0.40 0.34 p a 1 10.5 fp-16dav renesas code jeita package code previous code max nom min dimension in millimeters symbol reference 2.20 0.90 0.70 0.50 5.50 0.20 0.10 0.00 0.46 0.25 0.20 0.15 7.80 8 0 0.12 1.15 10.06 0.24g mass[typ.] 1 e 1 1 2 l z h y x c b a e d b c e l a p-sop16-5.5x10.06-1.27 prsp0016dh-b * 1 * 2 e 8 1 16 9 xm p * 3 y f index mark b d e h z a terminal cross section ( ni/pd/au plating ) p c b 1 1 detail f l l a note) 1. dimensions" * 1 (nom)"and" * 2" do not include mold flash. 2. dimension" * 3"does not include trim offset. e
keep safety first in your circuit designs! 1. renesas technology corp. puts the maximum effort into making semiconductor products better and more reliable, but there is a lways the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placeme nt of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. notes regarding these materials 1. these materials are intended as a reference to assist our customers in the selection of the renesas technology corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to renesas t echnology corp. or a third party. 2. renesas technology corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. all information contained in these materials, including product data, diagrams, charts, programs and algorithms represents i nformation on products at the time of publication of these materials, and are subject to change by renesas technology corp. without notice due to product improvement s or other reasons. it is therefore recommended that customers contact renesas technology corp. or an authorized renesas technology corp. product distrib utor for the latest product information before purchasing a product listed herein. the information described here may contain technical inaccuracies or typographical errors. renesas technology corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies o r errors. please also pay attention to information published by renesas technology corp. by various means, including the renesas techn ology corp. semiconductor home page (http://www.renesas.com). 4. when using any or all of the information contained in these materials, including product data, diagrams, charts, programs, a nd algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. renesas technology corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. renesas technology corp. semiconductors are not designed or manufactured for use in a device or system that is used under ci rcumstances in which human life is potentially at stake. please contact renesas technology corp. or an authorized renesas technology corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerosp ace, nuclear, or undersea repeater use. 6. the prior written approval of renesas technology corp. is necessary to reprint or reproduce in whole or in part these materi als. 7. if these products or technologies are subject to the japanese export control restrictions, they must be exported under a lic ense from the japanese government and cannot be imported into a country other than the approved destination. any diversion or reexport contrary to the export control laws and regulations of japan and/or the country of destination is prohibited. 8. please contact renesas technology corp. for further details on these materials or the products contained therein. sales strategic planning div. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan http://www.renesas.com refer to " http://www.renesas.com/en/network " for the latest and detailed information. renesas technology america, inc. 450 holger way, san jose, ca 95134-1368, u.s.a tel: <1> (408) 382-7500, fax: <1> (408) 382-7501 renesas technology europe limited dukes meadow, millboard road, bourne end, buckinghamshire, sl8 5fh, u.k. tel: <44> (1628) 585-100, fax: <44> (1628) 585-900 renesas technology hong kong ltd. 7th floor, north tower, world finance centre, harbour city, 1 canton road, tsimshatsui, kowloon, hong kong tel: <852> 2265-6688, fax: <852> 2730-6071 renesas technology taiwan co., ltd. 10th floor, no.99, fushing north road, taipei, taiwan tel: <886> (2) 2715-2888, fax: <886> (2) 2713-2999 renesas technology (shanghai) co., ltd. unit2607 ruijing building, no.205 maoming road (s), shanghai 200020, china tel: <86> (21) 6472-1001, fax: <86> (21) 6415-2952 renesas technology singapore pte. ltd. 1 harbour front avenue, #06-10, keppel bay tower, singapore 098632 tel: <65> 6213-0200, fax: <65> 6278-8001 renesas technology korea co., ltd. kukje center bldg. 18th fl., 191, 2-ka, hangang-ro, yongsan-ku, seoul 140-702, korea tel: <82> 2-796-3115, fax: <82> 2-796-2145 renesas technology malaysia sdn. bhd. 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